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ARAKAWA Flux

Solder  PINE FLUX 

WHD-001及WHP-002 Is collected from the pine wood rosin extracted co defended agent having relatively stable material characteristics for a variety of metals and alloys. Temperature from about 125 ℃ to 350 ℃. Suited to lead. Lead-free wafer bumping process and high brightness LED restrain gold away.

The use of rosin technology, made from general purpose to the special purpose, echoing the diversification applied to electronic components,
 

WHD-001及WHP-002 Is collected from the pine wood rosin extracted co defended agent having relatively stable material characteristics for a variety of metals and alloys. Temperature from about 125 ℃ to 350 ℃. Suited to lead. Lead-free wafer bumping process and high brightness LED restrain gold away.
 

Features:
High solubility
High security Applications:
 

Applications:

Products suitable for wafer bumping, solder balls packaged LED components.







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